Stock image Inside of burned integrated circuit on flexible PCB membrane detail. Visible silicon wafer and fine gold wires in hole of molten microchip package DIP-20. Replacement of damaged electronic component.
Published: Sep.03, 2020 13:44:42
Author: KPixMining
Views: 43
Downloads: 2
File type: image / jpg
File size: 18.23 MB
Orginal size: 7000 x 3938 px
Available sizes:
Level: bronze
